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SiS Showcases The Industry's First Highly Integrated Single Chip - SiS730S for AMD Athlon™ and AMD Duron™ CPUs
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~ SiS730S optimizes the performance of AMD Athlon™ and AMD Duron™ Processor-Based PCs with Integrated Core Logic, Graphics and Connectivity Technologies ~
 Taipei, Aug. 7, 2000 - SiS, a logic products company, today held a press conference to present the first 3C integrated single chip - the SiS730S which optimizes the performance of AMD Athlon™ and AMD Duron™ CPUs. The SiS730S inherits the highly integrated product strategy of SiS and features with the state-of-the-art AGP 4x interface and ATA-100 IDE controller. It adopts advanced integration technology and brings the most cost competitive AMD CPU-based systems to users.
During the demonstration, the SiS730S incorporates seamlessly with AMD Athlon™ CPU platform when running graphics and multimedia application. The built-in SiS300, a 128-bit 3D/2D graphics chip, which allows the video memory to share with the system memory up to 64 MB, and enables a dramatic 3D VR effect. Furthermore, it provides hardware DVD playback that significantly contributes lower CPU usage to systems. The result is a platform that features richer graphics and multimedia content in today's applications.
The SiS730S not only delivers the rich graphics and multimedia content, also provides up-to-date PC133 SDRAM, ATA-100 IDE and a stand-alone AGP 4x slot. The stand-alone AGP 4x slot is especially designed for upgrades to easily accommodate future advances. In addition, a high quality data transferring capabilities, including 56K Modem, Fast Ethernet, 1/10Mb Home PNA, allows users to immerse themselves in surfing the Internet. The SiS730S can drive systems up to an ultimate level of performance.
SiS is expanding its integration strength from hardware to software. The SiS730S provides an all-in-one software for driver installation. With a click, the software can automatically implement the driver installation of built-in graphics, audio, and connectivity chips and it supports up to 32 languages. The worldwide first user-friendly interface software developed and introduced by SiS for Linux platform is also available on the SiS730S. The software supports hardware DVD playback, 5.1-channels and Internet applications. The SiS730S is compatible with all major OS like Windows 95/98/Me/2000, NT4.0, WinCE and Linux. The SiS730S is an ideal system solution for desktop PCs, Notebooks and Set-top boxes.
"SiS has proved to the market that it is a leader in integration technology. We are delighted to see the 3C integrated SiS730S bring enhanced features and capabilities to AMD Athlon?and AMD Duron? processor-based PCs," said Richard Heye, Vice President and General Manager, Texas Microprocessor Division.
In the conference, SiS also demonstrates the SiS630S, the expandable and most powerful of the 630 series that support Pentium III/II CPUs. Like the SiS730S, the SiS630S provides a stand-alone AGP 4x interface for future advances. It also supports Linux OS platform.
As a technological leader in integration, multimedia and mix-signal, adding with advanced wafer capacity assurance from its own fab, SiS is transforming from a fabless design house to logic products company. For the coming connected society, integration technology is a sure trend for information application products. And SiS has already gained a solid footing in the new wave.
The SiS730S chipset consists of the following key features:
Support all AMD Athlon™ / AMD Duron™ processors synchronous and asynchronous front side bus frequency
Support PC133, 3 DIMM slots and up to 1.5 GB main memory
Stand alone AGP 4x graphic card slot
ATA-100 IDE
Private IDE-to-MEM bus¡Atransfer rate up to132 MB/s
Support 6 OpenHCI USB ports
Built-in 128 bit 2D/3D graphic chip with SFB (Shared Frame Buffer) architecture and display memory size up to 64MB with 1920*1200 resolution supported
Flexible dual view application such as TV-Out, digital flat panel and secondary CRT with the SiS301 chip
Support 3D VR (Virtual Reality) with 3D stereoscopic glasses
Built-in H/W DVD accelerator engine
Built-in 3D positional audio
Flexible connectivity including 56K Modem, 10/100 Mb Fast Ethernet, and 1/10Mb Home PNA
Microsoft PC99A, ACPI compliant
The SiS730S is using the advanced 0.18-micro process technology and assembled in the highest pin count (672) plastic BGA package in the world.
The SiS730S will start pre-production in September in its own wafer fab. The SiS730S is priced at US$42 for 10K order. |
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