Taipei, October 14, 2005 --- Silicon Integrated Systems (SiS) today announced its successful participation in the “Mobile Platform Sales Forum” hosted by AMD in Nice, France early this week. SiS displayed its customers’ notebooks based on its star chipsets, such as SiS756, SiSM760 and SiSM760GX.

Following the success and positive feedback for a related forum held in Barcelona, Spain, last year, AMD chose Nice, a well-known tourist destination in France, for its mobile platform sales forum this year. At this year's forum, AMD presented its latest technologies for mobile platform, including uniquely specialized platforms and creative solutions. At the same time, AMD invited partners from around the world, including chipset designers and notebook makers, such as SiS, ASUS, Arima, ECS, MSI, MiTAC and Twinhead, to exhibit the latest notebooks supporting AMD Turion™ 64 Mobile Technology.

SiS demonstrated three star mobile chipsets that support the AMD Turion ™ 64 Mobile Technology, including the SiS756/964L chipset in the Twinhead 17K series notebook, SiSM760/963L chipset in the Fujitsu Siemens AMILO A7645 notebook, and SiSM760GX/964 chipset in the Averatec 4100 notebook.

SiS756, SiSM760 and SiSM760GX are SiS’s star products that support the AMD Turion™ 64 Mobile Technology , effectively supporting the latest advanced power-saving technology emphasized by AMD Turion™ 64 Mobile Technology, improving battery life and heat dispersion, and fully compatible with powerful 64-bit computing, new-generation Dual Core processors, PCI Express specifications, 64-bit and DDR2 technologies.

These three chipsets have been greatly favored by customers since their launch. Major customers who are currently using the SiS756 include ASUS, Twinhead and Uniwill, those using SiSM760 include Arima, Fujitsu Siemens, Averatec and NEC, and those using SiSM760GX include Acer, Averatec and NEC. Their popularity underscores the deep trust customers worldwide have in the quality of SiS mobile chipsets.