CeBIT, Hannover, Germany, March 9, 2006---Silicon Integrated Systems (SiS) today announced that its latest accomplishment of innovation will be first time introduced to the whole world at the upcoming event of CeBIT trade fair, 2006. They are going to present not only the new-developed computers and WLAN chip, but also the embedded system chipset and powerful multimedia chipset for Microsoft’s game console Xbox 360. Above all, the new product line of DRAM module will be showcased at this annually international event at the first time.

This year at CeBIT, the highlight of the SiS exhibit will be centered on chipsets including SiS656, SiS649, SiS649DX, SiS649FX, SiS661FX, SiS661GX, SiS756, and SiS761GX, which fully support Dual-Core processor. SiS once again shows its remarkable technology innovation capabilities.

Dual-Core is a predictable trend when we are talking about the development of processor. SiS’ entire line of chipsets support Dual-Core processor, PCI Express specification, DDR2-667 memory, SATA2 IDE controller, WLAN, Gigabyte Ethernet, 64-bit platform and those features are the main points in developing innovative technology. At CeBIT 2006, SiS booth will be divided into 7 areas including desktop PC, notebook PC, partners’ motherboards, embedded system platform, WLAN product, also Xbox 360 gaming zone and DRAM module displays. The exhibition shows the huge efforts that SiS R&D team had put in for the past year and the accomplishment they have reached.

In desktop PC live demo area, SiS displays a series of chipsets which support Intel and AMD platform. SiS649FX/966, SiS656FX/966, SiS662/966 integrated chipsets support Intel® Pentium® 4 platform, and SiS761GX/966, SiS756/966, SiS770/966 integrated chipsets support AMD Athlon™ 64 FX platform. With the perfect match of those chipset comes from SiS supports Dual-Core processor, PCI Express specification, and DDR2-667 memory, visitors will be experiencing the excellent performance of Intel and AMD PC platforms.

In notebook PC live demo area, SiS will showcase numerous notebook PC using Intel® Pentium® M platform embedded with SiS M661MX. Notebook PC made by Acer, Asus, Clevo, Hitachi, Lenovo, and ECS will be on display.

Among those notebook PC makers using AMD Turion™ 64 platform, embedded with SiS756 would be Twinhead, SiSM760 would be Fujitsu Siemens, SiSM760GX would be Acer, Asus, NEC, Averatec. Lastly, Clevo adopts Mobile Intel® Pentium®4 platform which is embedded with SiS656.

As for the motherboard demo area, there will be a huge wall of motherboards on display representing the accomplishment of co-developing with well-known board makers from different regions of the world. Several major motherboard manufacturers like ECS and MSI have successfully launched their motherboards designing based on latest SiS761GX which provides support to AMD Socket AM2 platform. This efficient platform supports not only DDR2 memory specification but also dual-channel technology, and with it, the performance of operating system will be enormously increased. Besides, motherboards, built on SiS756, SiS770, SiS761GX which support AMD Socket 939 and AMD Socket754, made from Asus, AOpen, Asrock, Axper, ECS, and MSI will be on display. Also, motherboards from Asus, ECS, Foxconn, Fujitsu Siemens, Gigabyte, and MSI built on SiS656, SiS649, SiS649FX, SiS649DX, SiS661FX, and SiS661GX supporting Intel platform will be displayed as well.

More and more PC manufacturers have been raised the interests in developing IPC since the development of chipset is getting complete. Therefore, embedded system platform plays a crucial role in the exhibition. Embedded with SiS741CX, SiS661FX, SiS661CX would be the board makers include Lianlec, Maple, IEi, Lite-On, Ibase. Thin Client made by HP and Teco, LCD TV made by Samsung are all embedded with SiS741CX; Web Pad made by Sesol is equipped with SiS552.

In WLAN card demo area, USB Dongle, Mini PCI Module, and CF which have been designed based on SiS163/163U chips under 802.11b/g or 802.11a/b/g interface will be displayed. Markers include Cameo, CC&C, TP-Link, KingNet, Qcom, Alpha Network, Pronets, Tenda, and Zioncom.

SiS’ customized multimedia chipset for Microsoft’s Xbox 360 ignites a fever for its performance in the US, and combing with PCI Express technology and providing high speed transmission enable I/O interface device work faster and more efficient. During the exhibition, Xbox 360 will be available for all visitors to personally experience the power of SiS chipset brought to the games.

As for DRAM module demo area, SiS will put on display a wide range of specifications of DRAM modules for various applications. Providing supports to different requirements of speed, size, and memory capacity for desktop and notebook PC come out DDR2-800, DDR2-667, DDR2-533, DDR-400, and DDR-333. With support of SiS DRAM module, the performance of system will be efficiently, perfectly, and competitively no matter in compatibility, reliability, or in quality.

At CeBIT Hannover 2006, SiS is going to show the world the achievement and accomplishment of its R&D team in developing advance technology of high-end chipsets and new product line of DRAM module. SiS has determined to stay on being the leading supplier of core logic chipsets by keeping making breakthroughs and innovation.