Taipei, Jan. 24th, 2007—SiS today presented its latest technology to embrace the upcoming world of embedded systems by participating in DTF 2007 Embedded World. With the speech topic of “Delivering High-Performance & Low-Power Embedded x86 Chipset Solutions,” SiS showed off its achievements of developing chipsets for the embedded systems.

DTF 2007 was held on Jan. 24th at The Westin Taipei. This year, the forum is co-held by Digitimes, Technology IT Weekly, and National SoC Program Office. SiS, as a successful chipset innovator, has the honor of being invited to make the speech of sharing its valuable experiences in developing the embedded systems. In the meantime, SiS presented its achievements to visitors by displaying partners’ products which successfully adopt SiS embedded chipsets. Displays range from Thin Clients, IPC mainboards, Eagle III platforms, and Server Boards.

SiS is well-experienced in innovating solutions for Desktop PCs and Notebook PCs. With the accumulated technology and know-how, SiS is easy to get involved in the embedded system field. For years, SiS has been co-developing extensive consumer electronics products covering Billboard, Thin Client, Tablet PC, Set-Top-Box, and etc. with worldwide leading manufactures such as Samsung, Fujitsu Siemens, HP…..and so on. In DTF 2007, SiS delivers its vision of digital home entertainment with the speech topic of “Delivering High-Performance & Low-Power Embedded x86 Chipset Solutions.”

The SiS741CX chipset, specially designed to support AMD platform and AMD Geode™ NX series processors, has been successfully implemented in Samsung 40’Multi-Function Monitor. Other than this, SiS has been co-developed different applications of the SiS741CX chipset with leading computer makers, such as HP and Fujitsu Siemens. The chipset is implemented in Thin Client, which is also displayed in DTF 2007.

Server board is another focus of SiS on developing embedded solution. The SiS756/SiS966 chipset is paired with AMD Opteron™ CPUs to exceed customer’s expectation of having excellent system stability. Again, the outstanding performance of SiS’ embedded chipset comes from the accumulated developing experience of PC chipsets.

SiS Eagle-3 platform is integrated with advanced SiS771/SiS966 chipset and AMD K8 CPUs to provide ultra-low power consumption and extremely high performance. The Mini-ITX motherboard is the smallest form factor developed by SiS and its 3rd party manufacturer for customers’ developing the platforms easier. As for the IPCs and Thin Clients, SiS has spent several years on co-developing with IPC and iEi, leading industrial PCs makers, to adopt the SiS761CX/SiS966 and the SiS661CX/SiS964 chipsets in their products.

SiS will continue developing a variety of embedded solutions to create a better life for customer. By participating in DTF 2007 Embedded World, SiS is going to disclose its vision of joining the digital entertainment world, and share the point of view with all the visitors.