CeBIT Hannover, Germany, Mar. 15^th, 2007---SiS today proudly unveiled its full line of DRAM Modules at CeBIT Hannover, which demonstrated SiS’ fruitful results in such an intense business for the last whole year.

SiS was determined to diversify its product portfolio since last year when it decided to get involved in DRAM Module business. In order to provide a complete and bundle solution for its customers, SiS has been focusing on developing the advanced DDR and DDR2 specifications. So far, DRAM Module business accounts for 20~30% of company’s total revenue.

The major reason why SiS can have such a great success is because of the accumulated developing experiences in innovating PC-related chipsets. Moreover, the strong R&D team and the quick responses to the market trend have contributed to the success. SiS DRAM modules have been well-accepted by global customers with the higher compatibility, more reliability, and better quality. SiS is the worldwide first to simultaneously adopt TSOP, BGA, and CDFN packaging in manufacturing DRAM modules. To fulfill customers’ needs of having bundle solutions, SiS expands its business scope to DRAM module. Therefore, customers range from motherboard makers, system providers, appliances developers, to OEM customers. With close partnership with UMC, SiS is easily to benefit from the vertical integration of companies’ resources so that it reflects on the manufacturing costs impressively. In order to have more competition advantages, SiS DRAM modules are manufactured under the advanced production process, enabling the production line to enter a mass production level in a short time. So, what SiS provides is more than just DRAM module, it is actually providing a service.

At CeBIT 2007 Hannover, SiS presented its DRAM module lineup which includes DDR2-800, DDR2-667, DDR2-533, DDR-400, and DDR333 for both desktop PCs and notebook PCs. The exhibition of DRAM modules section is not only physical products but also the accomplishment and capability of SiS’ developing DRAM module business. For the future, SiS will continue to develop more advanced DRAM module which features less power-consumption, more cost-effective, larger storage capacity and faster transfer speeds to satisfy even more customers’ requirements.