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SiS to Participate in WinHEC 2007
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Taipei, May 14th, 2007—SiS today announced that it participates in WinHEC 2007, which is considered one of the most important IT events every year. WinHEC 2007 is held from May 14 -17 in Los Angeles, California. First-hand information on technology investments will be delivered by Microsoft senior executives directly. Hardware industry leaders will share new experiences on the Windows Vista and Windows Server Longhorn foundation. Participants are able to get insights from the conference and the exhibition for further hardware development. SiS participates in such a grand event to catch the opportunity to share and exchange experiences with pioneering companies in the industry. SiS displays its latest innovations including the SiS672FX chipset for desktop PCs and the SiSM672MX for notebook PCs. Also, the entire product line of DRAM modules is showcased at the exhibition. Churchill, the world’s first board in the Mini DTX form factor supporting the Microsoft Home Server, is presented for the first time. The Churchill motherboard is co-developed by Gigabyte, AMD, and SiS for Home Sever. The Home Server is designed to be light-weighted, compact and flexible with everything packed into a small form factor chassis. The high performance SiS761GX/SiS966 chipset is implemented in this amazing platform enabling home users access their data more easily and efficiently. With a rich selection of high speed interfaces, the SiS761GX/SiS966 based Churchill offers a wide range of functions and applications for users. It is expected to draw a lot of attention at the exhibition. The SiS671FX chipset has been adopted by leading motherboard makers such as Fujitsu, PCCHIPS, and more. These SiS671FX based motherboards have all been entered mass production. Following the success of the SiS671FX chipset, SiS released Taiwan’s first chipset supporting Windows VistaTM Premium, the SiS672FX. At WinHEC 2007, the SiS672FX platform will be live-demoed at SiS booth. The Clevo M720S notebook PC, based on SiSM671MX/SiS968 chipset, is the newly-released product of Clevo. It comes in a 12-inch form factor and is very light-weight at 1.8kg. It supports high-speed UMTS/HSDPA protocols to offer wireless internet on-the-move. DRAM module is a significant product line of SiS. With the advanced manufacturing process and the ability of easily getting into mass production, SiS DRAM module has blooming demand in the market. The DDR and DDR2-series products will be showcased. SiS would like to invite you to join us at WinHEC 2007 for a better future in developing technology. *SiS booth at WinHEC 2007
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