Milestones

Since our founding in 1987, SiS has been deeply committed to the fields of mixed-signal and IC design. From technological R&D to global market expansion, every step reflects our dedication to innovation and quality. Below are the key milestones in SiS's development over the years.

2026

Jan

Consolidated revenue reached NT$424 million, a year-on-year increase of 171.58%, marking a record high since the company's transformation

2025

July

Company announced successful turnaround to profitability, driven by synergies from multiple acquisitions and capital restructuring

Jan

Completed share swap merger with Hycon Technology, expanding product portfolio into Battery Management Systems (BMS) and mixed-signal ICs

2024

Sep

Completed full acquisition of UnitedDS Semiconductor, entering ASIC design services and IP domains

2023

Aug

UMC Chairman Jason Wang appointed as Chairman of SiS

2022

Oct

Entered the Active Stylus market, achieving dual certifications for USI 2.0 and MPP 2.6 , successfully becoming a supplier to major international brands

2020

Sep

Invested in and established HuiTong intelligence Co., Ltd., entering the IoT chip design and development space

2016

Jan

Established strategic partnership with Microchip, launched integrated display modules combining 2D projected capacitive touch with 3D gesture recognition, and received "Best Touch Technology Award" at Digital Signage Expo

2014

Aug

Invested in and established Suzhou MLight Optoelectronics Technology Co., Ltd. (MLight)

2011

Jan

Entered Smart TV and touch technology markets, launching SiS 681 Android Smart TV SoC and projected capacitive touch controller ICs

2010

Aug

Merged with XGI Technology

2005

Nov

Certified and adopted by Microsoft as the Media I/O chip (Southbridge) supplier for Xbox 360 gaming console

2004

Feb

United Microelectronics Corporation (UMC) announced merger with SiS

2003

May

Established subsidiary XGI Technology

2002

Apr

Launched next-generation Xabre series graphics chips

2000

Mar

8-inch wafer fab commenced mass production

1999

Oct

Acquired Rise Technology (USA), obtaining mP6 x86 CPU technology

Jan

Launched SiS 300 3D graphics chip (mass production in April), continuing leadership in display technology

1998

Dec

SiS 6326 discrete graphics chip achieved great success with over 7 million units sold, receiving "Taiwan Excellence Award" and "MOEA New Product Development Award"

Oct

Construction of 8-inch wafer fabrication facility

1997

Aug

Listed on Taiwan Stock Exchange (TWSE) under stock code 2363

1987

Aug

Company founded with headquarters in Hsinchu Science Park, Taiwan, focusing on PC-related IC design

Milestone